| PART |
Description |
Maker |
| 35730-2900 0357302900 |
3.56mm (.140) Diameter Pin Receptacle Terminal, Brass, 0.35mm (.138) Thickness, Wire Range 14-20 AWG (2.00-0.52mm2), Unplated
3.56mm (.140") Diameter Pin Receptacle Terminal, Brass, 0.35mm (.138") Thickness, Wire Range 14-20 AWG (2.00-0.52mm虏), Unplated
|
Molex Electronics Ltd.
|
| HEDS-6500-A05 HEDS-6500-A10 HEDS-6500-A11 HEDS-650 |
HEDS-6510#005 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDS-6505#B05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDS-6500#A05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6500#T05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6505#T05 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDL-6545#B09 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDL-6540#B11 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
HEDM-6540#T11 · Large Diameter (56mm), Housed Two and Three Channel Optical Encoders
Large Diameter (56 mm), Housed Two and Three Channel Optical Enco
|
Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
|
| 0440671003 44067-1003 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
MOLEX Connector
|
Molex Electronics Ltd.
|
| 0440671401 44067-1401 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector
|
Molex Electronics Ltd.
|
| 44067-0603 0440670603 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
Molex Electronics Ltd.
|
| 44067-0201 0440670201 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140")
|
Molex Electronics Ltd.
|
| 0440672201 44067-2201 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140)
MOLEX Connector
|
Molex Electronics Ltd.
|
| 44067-1802 0440671802 |
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
|
Molex Electronics Ltd.
|
| PE1001-1 |
Hermetic Seal Solder Contact With 0.012 Pin Diameter, 0.1 Body Diameter And 0.18 Pin Length
|
Pasternack Enterprises, Inc.
|
| 87639-1011 0876391011 |
1.27mm (.050") Pitch DDR DIMM Socket, Reverse Footprint, 25掳 Angle, Low Profile, Single Key, with Beveled Metal Pins and Plastic Pegs, 3.56mm (.140") Tail Lengt
1.27mm (.050) Pitch DDR DIMM Socket, Reverse Footprint, 25° Angle, Low Profile, Single Key, with Beveled Metal Pins and Plastic Pegs, 3.56mm (.140) Tail Length
|
Molex Electronics Ltd.
|
| 460-3299 |
Crimp connector pin, .080 (2,03) diameter pin
|
CAMBION Electronic Components
|
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